Home > Products

Products

Spherical Copper Powder

Flake copper powder

Silver Coated Powder

 
Spherical Copper Powder > Copper Spherical Powder (CUSP20)
Mean Particle Size(SEM) ¡¡2.0 §­
Particle Size Distribution D10 : 1.0§­ ¡¡D50 : 2.0~2.4§­ ¡¡D90 : 3.0§­
Target Properties Tap Density : 4.4 g/§¨ ¡¡BET : 0.55 §³/g
  Oxygen (wt%) max. : 0.30
Carbon (wt%) max. : 0.05
Sulphur (wt%) max. : 0.01
Application MLCC termination paste. Thick film hybrid paste. Conductive adhesive.
 
 
 
 
 
contacts