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Spherical Copper Powder > Copper Spherical Powder
(CUSP20) |
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Mean Particle
Size(SEM) |
¡¡2.0 § |
Particle
Size Distribution |
D10
: 1.0§ ¡¡ D50
: 2.0~2.4§ ¡¡ D90
: 3.0§ |
Target Properties |
Tap
Density : 4.4 g/§¨ ¡¡ BET
: 0.55 §³/g |
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Oxygen (wt%) max. : 0.30
Carbon (wt%) max. : 0.05
Sulphur (wt%) max. : 0.01 |
Application |
MLCC termination paste. Thick
film hybrid paste. Conductive adhesive. |
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![](images/sizeCUSP20.jpg) |
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![](images/CUSP20(2000).jpg) |
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![](images/CUSP20(5000).jpg) |
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