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Spherical Copper Powder > Copper Spherical Powder (CUSP30)

Mean Particle Size(SEM)	3.0 ㎛
Particle Size Distribution	D10 : 1.8㎛　D50 : 2.8~3.5㎛　D90 : 4.3㎛
Target Properties	Tap Density : 4.5 g/㎤　BET : 0.50 ㎡/g
	Oxygen (wt%) max. : 0.30 Carbon (wt%) max. : 0.05 Sulphur (wt%) max. : 0.01
Application	MLCC termination paste. Thick film hybrid paste. Conductive adhesive.