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Spherical Copper Powder

Flake copper powder

Silver Coated Powder

 
Spherical Copper Powder > Copper Spherical Powder (CUSP30)
Mean Particle Size(SEM) ¡¡3.0 §­
Particle Size Distribution D10 : 1.8§­ ¡¡D50 : 2.8~3.5§­ ¡¡D90 : 4.3§­
Target Properties Tap Density : 4.5 g/§¨ ¡¡BET : 0.50 §³/g
  Oxygen (wt%) max. : 0.30
Carbon (wt%) max. : 0.05
Sulphur (wt%) max. : 0.01
Application MLCC termination paste. Thick film hybrid paste. Conductive adhesive.
 
 
 
 
 
 
 
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