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Spherical Copper Powder > Copper Spherical Powder (CUSP55)

Mean Particle Size(SEM)	5.5 ㎛
Particle Size Distribution	D10 : 4.0㎛　D50 : 5.3~5.8㎛　D90 : 7.2㎛
Target Properties	Tap Density : 4.8g/㎤　BET : 0.30 ㎡/g
	Oxygen (wt%) max. : 0.25 Carbon (wt%) max. : 0.05 Sulphur (wt%) max. : 0.01
Application	MLCC termination paste. Thick film hybrid paste. Conductive adhesive.